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A new report from The Wall Street Journal has shared more details on what could possibly causing the overheating issue in the iPhone 15 Pro models. According to the outlet’s sources, aside from titanium, the changes Apple introduced in the internals of the smartphones are reportedly causing heat dissipation issues.
The report specifically points to the new logic board in the iPhone 15, which is now redesigned. According to the “people familiar with the iPhone’s design” the report mentioned, the new logic board in the iPhone 15 has removed the gap made by the now-removed SIM tray on iPhones. To recall, Apple introduced eSIM in the iPhone 14 models in the US last year. This move has left a space where the SIM tray used to sit. Apple tried to fill this gap in the iPhone 14 using a plastic element and apparently took things further in the iPhone 15 by redesigning the logic board to consume this space.
“Adding a slot to the phone’s already-cramped interior creates additional challenges for heat dissipation,” the sources told the media outlet.
As expected, the report has also affirmed earlier claims about the impact of the titanium material on the issue. Earlier this week, supply chain analyst Ming-Chi Kuo commented on the matter, saying Apple‘s thermal system design compromises in order to achieve a lighter weight in the units are to blame. According to the report, the heat dissipation reduction and the use of titanium in the frames led to negative thermal efficiency impacts. Kuo then shrugged off the idea of the new A17 Pro chip as the culprit behind the problem.
Bloomberg’s Mark Gurman, nonetheless, believes that the chip could be a contributing factor since it is used to run heavy AAA video games. Yet, Gurman has also shared that there are reports of users experiencing the issue even when just using the units for casual purposes, including the use of social media apps. According to the journalist, Apple is now handling numerous calls regarding the issue but only directs customers to an old article telling users what not to do to prevent the problem. As expected, no exact solution for the issue is mentioned in the support document.
