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The iPhone 15 Pro continues to amaze us. In a recent teardown review, TechInsights discovered that the model contains a more compact DDR5 chip. If the company pushes this into the next series of iPhones, the giant can save more space for other components and part innovations.
“In a recent teardown of the Apple iPhone 15 Pro, TechInsights has discovered a remarkable find – Micron’s cutting-edge D1β LPDDR5 DRAM chips,” reports the semiconductor analysis website. “These chips mark the industry’s first foray into the D1β generation, and they are nothing short of impressive.”
TechInsights also underscored Micron’s impressive work in the chip, which skipped the use of EUVL. “One of the most remarkable aspects of Micron’s D1β DRAM technology is that it eschews Extreme Ultraviolet Lithography (EUVL), a technique adopted by competitors like Samsung and SK Hynix for their DRAM processes. EUVL was seen as an essential enabler for scaling down DRAM processes to sub-15nm levels. However, Micron has defied expectations by successfully developing and manufacturing the D1z, D1α, and now D1β DRAM chips without the use of EUVL technology.”
As the review notes, the main attraction of the D1β LPDDR5 16 Gb DRAM chip, AKA Y52P die, is its smaller physical size while having “a remarkable increase in density” versus the former LPDDR5/5X D1α 16 Gb die. In iPhone 16, using the same chip will help the Cupertino company further save space for other hardware parts it plans to upgrade.
According to a recent claim by a leaker, Apple will also do this next year in its printed circuit boards using a new material. The leaker specifically shared that Apple would start using RCC adhesive-backed copper foil as its new PCB material in 2024. This will mark Apple’s departure from using flexible copper substrate material in its PCBs, but the replacement will reportedly make the part thinner.
