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A new claim from a leaker on Weibo (via MacRumors) says that Apple plans to produce thinner printed circuit boards using a new material. According to the post, this plan will start as soon as next year, which means we could see this change in the iPhone 16 next year.

The leaker specifically shared that Apple would start using RCC adhesive-backed copper foil as its new PCB material in 2024. This will mark Apple’s departure from using flexible copper substrate material in its PCBs, but the replacement will reportedly make the part thinner.

In case true, the move should complement earlier reports of Apple planning to upgrade the hardware in the iPhone 16, including the camera. As expected, component improvements usually require more space for the new parts. With this, it would make sense if Apple would make its PCBs thinner to gain more space within its new iPhone creations. According to other reports, Apple will also be introducing bigger screens in iPhone 16 Pro models (6.3 and 6.9 inches versus iPhone 15 Pro and iPhone 15 Pro Max’s 6.1- and 6.7-inch screens, respectively), allowing the company to gain more space to explore in its next series. 

In related news, PCB isn’t the only one that will reportedly be improved next year. According to a recent report, Apple would also include new parts such as three small cameras related to Vision Pro and a capacitive “Capture Button.” Rumor has it that the company will also shift to the cheaper N3E process for the standard iPhone 16’s A17 chip in 2024. These details add to the current claims revolving around the iPhone 16 lineup, including the addition of the A18 chip in iPhone 16 Pro models, a microlens display, Wi-Fi 7, and a super telephoto periscope camera


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