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Supply chain analyst Ming-Chi Kuo shares in a report that there won’t be using resin-coated copper (RCC) material in its iPhone next year. According to Kuo, 2025 is the earliest prediction for the tech to be ready, indicating that it won’t be applied in iPhone 16 models.

RCC can be a helpful part of the creation of future iPhones in order to save more space internally. An earlier report from a leaker on Weibo claimed that it would be implemented in 2024:

The leaker specifically shared that Apple would start using RCC adhesive-backed copper foil as its new PCB material in 2024. This will mark Apple’s departure from using flexible copper substrate material in its PCBs, but the replacement will reportedly make the part thinner.

In case true, the move should complement earlier reports of Apple planning to upgrade the hardware in the iPhone 16, including the camera. As expected, component improvements usually require more space for the new parts. With this, it would make sense if Apple would make its PCBs thinner to gain more space within its new iPhone creations. According to other reports, Apple will also be introducing bigger screens in iPhone 16 Pro models (6.3 and 6.9 inches versus iPhone 15 Pro and iPhone 15 Pro Max’s 6.1- and 6.7-inch screens, respectively), allowing the company to gain more space to explore in its next series. 

Kuo, however, believes this won’t be possible as RCC isn’t ready yet. As underscored in his report, RCC’s “fragile characteristics and inability to pass drop tests” is the reason behind this delay. Ajinomoto, the main RCC material supplier, is now reportedly working with Apple to improve it before the third quarter of 2024. As such, the Cupertino giant might still have to wait until 2025 to use the material, which will allow more free iPhone internal space for other component upgrades. 


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